creat by art - low power loss, high efficiency - guardring for overvoltage protection - high surge current capability - ul recognized file # e-326243 - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 base p/n with suffix "g" on packing code - halogen-free base p/n with prefix "h" on packing code - aec-q101 qualified terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test with prefix "h" on packing code meet jesd 201 class 2 whisker test v rrm 20 30 40 50 60 90 100 150 v v rms 14 21 28 35 42 63 70 105 v v dc 20 30 40 50 60 90 100 150 v i f(av) a r jc o c/w t j o c t stg o c document number: ds_d1309023 version: i13 storage temperature range - 55 to +150 note 1: pulse test with pw=300 s, 1% duty cycle 1.5 typical thermal resistance operating junction temperature range - 55 to +125 - 55 to +150 maximum reverse current @ rated vr t j =25 t j =100 t j =125 i r 0.5 0.1 ma 15 10 - -5 a maximum instantaneous forward voltage (note 1) i f = 10 a v f 0.55 0.70 0.92 1.02 v maximum dc blocking voltage maximum average forward rectified current 20 peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 200 srf 2090 srf 20100 srf 20150 unit maximum repetitive peak reverse voltage maximum rms voltage mounting torque: 5 in-lbs maximum weight: 1.7 g (approximately) maximum ratings and electrical characteristics (t a =25 unless otherwise noted) parameter symbol srf 2020 srf 2030 srf 2040 srf 2050 srf 2060 ito-220ab mechanical data case: ito-220ab polarity: as marked srf2020 thru srf20150 taiwan semiconductor dual common cathode schottk y rectifier features - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec
part no. part no. srf2060 srf2060 srf2060 (ta=25 unless otherwise noted) document number: ds_d1309023 version: i13 srf2060hc0 h c0 aec-q101 qualified ratings and characteristics curves srf2060 c0 c0 srf2060 c0g c0 g green compound note 1: "xx" defines voltage from 20v (srf2020) to 150v (srf20150) example preferred p/n aec-q101 qualified packing code green compound code description srf20xx (note 1) prefix "h" c0 suffix "g" ito-220ab 50 / tube srf2020 thru srf20150 taiwan semiconductor ordering information aec-q101 qualified packing code green compound code package packing 0 5 10 15 20 25 0 25 50 75 100 125 150 average forward current (a) lead temperature ( o c) fig.1 forward current derating curve srf2060 - 20150 srf2020 - 2050 resistive or inductive load with heatsink 0 50 100 150 200 250 1 10 100 peak forward surge current (a) number of cycles at 60 hz fig. 2 maximum non-repetitive forward surge current 0.001 0.01 0.1 1 10 0 20 40 60 80 100 120 140 instantaneous reverse current. (ma) percent of rated peak reverse voltage.(%) fig. 4 typical reverse characteristics tj=25 tj=100 0.1 1 10 100 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 instantaneous forward current (a) forward voltage (v) fig. 3 typical forward characteristics srf2020-2040 srf2050-2060 srf20150 SRF2090-20100
min max min max a 4.30 4.70 0.169 0.185 b 2.50 3.16 0.098 0.124 c 2.30 2.96 0.091 0.117 d 0.46 0.76 0.018 0.030 e 6.30 6.90 0.248 0.272 f 9.60 10.30 0.378 0.406 g 3.00 3.40 0.118 0.134 h 0.95 1.45 0.037 0.057 i 0.50 0.90 0.020 0.035 j 2.40 3.20 0.094 0.126 k 14.80 15.50 0.583 0.610 l - 4.10 - 0.161 m 12.60 13.80 0.496 0.543 n - 1.80 - 0.071 o 2.41 2.67 0.095 0.105 p/n = specific device code g = green compound yww = date code f = factory code document number: ds_d1309023 version: i13 marking diagram srf2020 thru srf20150 taiwan semiconductor package outline dimensions dim. unit (mm) unit (inch) 100 1000 10000 0.1 1 10 100 junction capacitance (pf) reverse voltage (v) fig. 5 typical junction capacitance srf2020-2040 srf2050-2060 SRF2090-20150 f=1.0mhz vslg=50mvp-p 0.1 1 10 100 0.01 0.1 1 10 100 transient thermal impedance ( /w) t-pilse duration(s) fig. 6 typical transient thermal impedance
creat by art assumes no responsibility or liability for any errors inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1309023 version: i13 srf2020 thru srf20150 taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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